nichia sts-da1-1257a nichia corporation specifications for amber led NFSA172t pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-1257a 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 250 ma pulse forward current i fp 350 ma allowable reverse current i r 85 ma power dissipation p d 875 mw operating temperature t opr -40 100 c storage temperature t stg -40 100 c junction temperature t j 150 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10 ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ. unit forward voltage v f i f =150ma 3.2 v luminous flux v i f =150ma 25 lm x - i f =150ma 0.57 - chromaticity coordinate y - i f =150ma 0.42 - * characteristics at t s =25c. * luminous flux value is traceable to the cie 127:2007-compliant national standards. * the chromaticity coordinates are derive d from the cie 1931 chromaticity diagram. ranks item rank min. max. unit forward voltage - 2.65 3.50 v p11 30.3 36.0 p10 25.5 30.3 p9 21.4 25.5 luminous flux p8 18.0 21.4 lm color rank rank l3 x 0.576 0.549 0.562 0.589 y 0.407 0.425 0.438 0.411 * ranking at t s =25c. * tolerance of measurements of the forward voltage is 0.05v. * tolerance of measurements of the luminous flux is 7%. * tolerance of measurements of the chromaticity coordinate is 0.01. * basically, a shipment shall consist of the leds of a comb ination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia.
nichia sts-da1-1257a 2 chromaticity diagram 600 590 580 l3 0.30 0.35 0.40 0.45 0.50 0.45 0.50 0.55 0.60 0.65 x y
nichia sts-da1-1257a 3 outline dimensions sts-da7-0063a nfsx172 ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ka o protection device 0.5 2.7 2.7 1 cathode anode 0.8 (2.3) 3 3 (2.3) cathode mark ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ?? ceramics ?`? ? + w? silicone resin (with diffuser and phosphor) ? au-plated 0.024g (typ)
nichia sts-da1-1257a 4 soldering ? recommended reflow soldering condition ? recommended manual soldering condition temperature 350c max. soldering time 3 sec. max. recommended soldering pad pattern ( g unit: mm) 3 0.5 3.6 * the product is designed to be reflow soldered to a pcb. if you use dip soldering for the products, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twice. manual soldering mu st only be done once. * care should be taken to avoid cooling at a rapid ra te and ensure the peak temperature ramps down slowly. * customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation due to the heat and atmosphere of reflow soldering. * since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant. failure to comply might lead to nicks, chip-outs, delamination and deformation of the encapsulant, bump breakage and an adverse effect on product reliability. * repairing should not be done after the leds have been solder ed. when repairing is unavoidabl e, a double-head soldering iron should be used. it should be confirmed beforeha nd whether the characterist ics of the leds will or will not be damaged by repairing. * when soldering, avoid applying any stress to the led package while heated. 120sec. max. pre-heat 180 to 200c 260c max. 10 sec. max. 60 sec. max. above 220c 1 to 5c per sec.
nichia sts-da1-1257a 5 tape and reel dimensions sts-da7-0064 quantity per reel = 4000 pcs 1 `?? 4000 ? * nfsx172t ?`??? tape 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 -0 1.5 +0.1 8 +0.3 -0.1 ?` / ` trailer and leader top cover tape led ?? ` min 400mm ?`min 160mm ? trailer 160 mm min (empty pockets) loaded pockets ???` embossed carrier tape ???`?` feed direction leader without top cover tape 400 mm min min 100mm ? leader with top cover tape 100 mm min (empty pocket) `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? label 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0.3 60 +1 -0 180 +0 -3 the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ???`??????? ? no. ( g unit: mm) 3.3 0.1 0.2 0.05 1.05 0.1 3.3 0.1 cathode mark -0 1 +0.25
nichia sts-da1-1257a 6 packaging - tape & reel nichia led sts-da7-0006 nxxxxxxxx ? label ? label ? no. ????`??????`???? moisture absorbent material ? reel ` ?` seal moisture proof foil bag ?? the reel is placed in the moisture proof bag with a moisture absorbent material. the bag is heat sealed. ??K???`? the moisture proof foil bags are packed in a cardboard box with corrugated partition. customer is advised to pack the products in the original packaging or equivalent in transit. ??\H?y?B???y? * the cardboard box is not water-resistant. do not expose to water. ?`???????y?????? * do not drop the cardboard box or expose it to shoc k. if the box falls, the products could be damaged. ?QH??n?????u?p?????? * the products are taped and reeled, and then packed in moisture-proof bags. the moisture-proof bags are packed in cardboard boxes to prevent damage during shipment. * u???`?????n?go??`y? ? for details, see "lot numbering scheme" in this document. * ??????????? if not provided, it is not indicated on the label. ******* is the customer part number. O??????? * ******* ?? the label does not have the rank field for un-ranked products. * ??????????? rohs nxxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan
nichia sts-da1-1257a 7 lot numbering scheme lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordi nates, ranking by luminous flux
nichia sts-da1-1257a 8 derating characteristics nfsx172 sts-da7-0059 ? no. derating1 0 100 200 300 400 500 0 20406080100120 (70, 250) (100, 157) derating2 0 100 200 300 400 500 0 20 40 60 80 100 120 (100, 250) duty 10 100 1000 1 10 100 250 350 S allowable forward current ( ma ) `?????? - S solder temperature (cathode side) vs allowable forward current ?? - S ambient temperature vs allowable forward current S allowable forward current (ma) S allowable forward current (ma) `?????? solder temperature (cathode side) (c) ?? ambient temperature (c) ?`?` du ty rati o (%) ?`?` S duty ratio vs allowable forward current t a = 25c 95 c/w ja r =
nichia sts-da1-1257a 9 optical characteristics NFSA172 ? no. sts-da7-0060a spectrum 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 ? relative illuminance (a.u .) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -2 0 -30 -4 0 -50 -60 -70 -80 -9 0 k??? spectrum k? relative emission intensity (a.u.) L wavelength (nm) ? directivity ? radiation angle 10.500.51 150 ma i fp = t a = 25c 15 0 ma i fp = t a = 25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-1257a 10 forward current characteristics / temperature characteristics NFSA172 sts-da7-0061a ? no. tavf 2.0 2.5 3.0 3.5 4.0 4.5 -60 -40 -20 0 20 40 60 80 100 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 1 00 120 vfif 10 100 1000 2.02.53.03.54.04.5 150 350 relative luminous flux (a.u.) ?? - ambient temperature vs relative luminous flux for ward curren t (ma) ifiv 0.0 0.5 1.0 1.5 2.0 2.5 0 100 200 300 400 500 relative luminou s flux (a.u .) - forward current vs relative luminous flux for ward current (ma) ?R - forward voltage vs forward current ?? - ?R ambient temperature vs forward voltage ?R for ward vol ta g e ( v ) ?R forward voltage (v) ?? ambient temperature ( c) ?? ambient tem p erature ( c ) t a = 25c * ??? all characteri st ics show n are for reference only an d are not guaranteed. i fp = 150 ma i fp = 150 ma t= 25c a
nichia sts-da1-1257a 11 forward current characteristics / temperature characteristics ? no. NFSA172 sts-da7-0062a taxy 0.410 0.415 0.420 0.425 0.430 0.560 0.565 0.570 0.575 0.580 -40c 0c 25c 50c 100c x ifxy 0.410 0.415 0.420 0.425 0.430 0.560 0.565 0.570 0.575 0.580 20 ma 15 0 ma 350 ma x y y 150 ma i fp = ?? - ? ambient temperature vs chromaticity coordinate - ? forward current vs chromaticity coordinate t a = 25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-1257a 12 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # unites failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld = 260c, 10 sec, 2 reflows, precondition: 30c, 70%rh, 168 hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld = 2455c, 5 sec, lead-free solder (sn-3.0ag-0.5cu) #2 0/22 thermal shock jeita ed-4701 300 307 -40c to 100c, 1 min dwell, 10 sec transfer, precondition: 30c, 70%rh, 168 hr 100 cycles #1 0/50 temperature cycle jeita ed-4701 100 105 -40c (30 min) ~ 25c (5 min) ~ 100c (30 min) ~ 25c (5 min) 100 cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c ~ 65c ~ -10c, 90%rh, 24 hr per cycle 10 cycles #1 0/50 high temperature storage jeita ed-4701 200 201 t a =100c 1000 hours #1 0/50 temperature humidity storage jeita ed-4701 100 103 t a =60c rh=90% 1000 hours #1 0/50 low temperature storage jeita ed-4701 200 202 t a =-40c 1000 hours #1 0/50 room temperature operating life t a =25c i f =250ma test board: see notes below 1000 hours #1 0/50 high temperature operating life t a =100c i f =150ma test board: see notes below 1000 hours #1 0/50 temperature humidity operating life 60c rh=90% i f =200ma test board: see notes below 1000 hours #1 0/50 low temperature operating life t a =-40c i f =150ma test board: see notes below 1000 hours #1 0/50 permanence of marking jeita ed-4701 500 501 isopropyl alcohol, 235c, dipping time: 5 min 1 time #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100 ~ 2000 ~ 100 hz, 4 cycles, 4 min, each x, y, z 48 minutes #1 0/10 electrostatic discharges jeita ed-4701 300 304 hbm, 2 kv, 1.5 k ? , 100 pf, 3 pulses, alternately positive or negative #1 0/22 notes: 1) test board: fr4 board thickne ss = 1.6 mm, copper layer thickness = 0.07 mm, r ja 95c/w 2) measurements are performed after allo wing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage (v f ) i f =150ma > initial value 1.1 #1 luminous flux ( v ) i f =150ma < initial value 0.7 #2 solderability - less than 95% solder coverage
nichia sts-da1-1257a 13 cautions (1) storage conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168 hours baking 655c - 24 hours this product is compliant to jedec msl 3 or equivalent. see ipc/jedec std-020 for the details of the moisture sensitivity leve ls. interface delamination can occur due to vaporization and expa nsion of absorbed moisture in the led packages caused by soldering heat, which may result in degradation in optical performance. to minimize moisture absorption into the products during the transportation and storage, the products are pa cked in a moisture-proof aluminum bag. desiccants (silica gel) inside the packing turn from blue to red as it absorbs moisture. after opening the moisture-proof alumin um bag, the products should be comple ted soldering process within the range of the conditions above. if unused leds remain, they should be stored with desicc ants (silica gel) in hermetically sealed container. nichia recommends using th e original moisture-proof bag for storage. after the "period after opening" specified above, or if th e desiccants (silica gel) are no longer blue, the products need to be baked. note that baking must only be done once. although the leads or electrode pads (anode and cathod e) of the product of the product are plated with gold, prolonged exposure to a corrosive environment might caus e the gold plated the leads or electrode pads to tarnish, and thus leading to difficulties in soldering. if unused leds remain, they must be stored in a hermetically sealed container . nichia recommends using the origin al moisture-proof bag for storage. to avoid condensation, the pr oducts must not be stored in the areas where temperature and humidity fluctuate greatly. (2) directions for use in designing a circuit, the cu rrent through each led must not exceed the abso lute maximum rating specified for each led. it is recommended to use circuit b which regulates the current flowing th rough each led. in the meanwhile, when driving leds with a constant voltage in circuit a, the cu rrent through the le ds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... this product should be operated in forwar d bias. a driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. in part icular, if a reverse voltage is co ntinuously applied to the produc t, such operation can cause migration resulting in led damage. for stabilizing the led characteristics, it is recommen ded to operate at 10% of the rated current or higher. for outdoor use, necessary measures should be take n to prevent water, moisture and salt air damage. (3) handling precautions when handling the product, do not touc h it directly with bare hands as it may contaminate the surface and affect on optical characteristics. in the worst cases, excessive fo rce to the product might result in catastrophic failure due to package damage and/or bump breakage. when handling the product with tweezers, make sure that exce ssive force is not applied to th e resin portion of the product. failure to comply can cause the resin portion of the product to be cut, chippe d, delaminated and/or deformed, and bump to be broken, and thus resu lting in catastrophic failure. if the product is dropped, it might be damaged. do not stack assembled pcbs together. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed, and bump to be br oken, and thus resulting in catastrophic failure.
nichia sts-da1-1257a 14 (4) design consideration pcb warpage after mounting the products onto a pcb can cause the package to brake. the leds should be placed so as to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerte d on the leds placed near the score lines. the leds should be placed so as to minimi ze the stress on the leds due to board flexing. board separation must be performed using special jigs, not with hands. if an aluminum pcb is used, customer is advised to verity the pcb with th e products before use. thermal stress during use can cause the solder joints to crack. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltag e. an esd event may damage its die or reduce its reliability performance. when handling the products , measures against electro static discharge, including the followings, are strongly recommended. eliminating the charge; wrist strap, esd footwear and garments, esd floors grounding the equipm ent and tools at workstation esd table/shelf mat (conductive materials) proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products. also note that surge protection should be considered in the design of customer products. if tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge , including the followings, are strongly recommended. dissipating the charge with conductive materials preventing the charge generation with moisture neutralizing the charge with ionizers when performing the characteristics inspecti on of the leds in your application, cu stomer is advised to check on the leds whether or not they are damaged by esd. such dama ge can be detected during forward voltage measurement or lightup test at low current. (t he recommended current is 1ma or lower) esd-damaged leds may have a current flow at low voltage, or no longer light up at low current. failure criteria: v f < 2.0v at i f = 0.5ma (6) thermal management thermal management is an important fact or when designing your product by using the leds. the rise in led die temperature can be affected by pcb thermal resist ance or/and led spacing as mounted on the board. customer is advised to design the product to ensure that the led die temperature do es not exceed the required maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j = t a + r ja ? w 2) t j = t s + r js ? w *t j = led junction temperature: c t a = ambient temperature: c t s = soldering temperature (cathode side): c r ja = thermal resistance from junction to ambient: c/w r js = thermal resistance from junction to t s measuring point 30c/w w = input power (i f x v f ): w ts point
nichia sts-da1-1257a 15 (7) cleaning if required, isopropyl alcohol (ipa) should be used. othe r solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not recommended fo r the leds since it may adve rsely effect on the leds by the ultrasonic power and led assembled condition. if it is unavoidable, custom er is advised to check prior to use that the cleaning will not damage the leds. (8) eye safety the international electrical commission (iec) publishe d in 2006, iec 62471:2006 photobiological safety of lamps and lamp systems which includes leds within its scope. meanwhile leds were removed from the scope of the iec 60825-1:2007 laser safety standard, the 2001 edition of which included led sources within its scope. however, keep it mind that some countries and regi ons have adopted standards based on the iec laser safety standard iec 60825-1:2001 which includes leds within its scope. following iec 62471:2006, most of nichia leds can be classified as be longing to either exempt group or risk group 1. especially a high-power led, that emits light co ntaining blue wavelengths, may be in risk group 2. great care should be taken when viewing directly the led driven at high current or the led with optical instruments, which greatly increase the hazard to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, precaution should be taken to avoid adverse e ffect on human body caused by the light stimulus. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipmen t (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor co ntrol system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer sh all inform nichia directly before disassembling or analysis. customer and nichia shall agree the official specification of supplied products prior to the st art of a customer?s volume prod uction. the appearance and specifications of the produc t may be modified for improvement without notice.
|
